DN Solutions, the world’s third-largest and South Korea’s leading machine tool manufacturer, has launched its new DNC series (DNC 8050, DNC 8060) of high-precision grinding machines for semiconductor manufacturing.

The name ‘DNC’ stands for DN Solutions Ceramic, representing the company’s ceramic machining equipment. These machines are designed to manufacture consumable components such as focus rings used in the semiconductor wafer process. Since these parts operate inside chambers that endure high temperatures and exposure to chemicals, they are made from materials like quartz, ceramic and silicon carbide (SiC) — all of which are notoriously hard to machine. The DNC series enables precise grinding of these hard-to-cut materials.

Quartz is harder than carbon steel yet brittle and prone to fracture, making it challenging to machine with conventional tools. Even with costly diamond tools, micro-cracks and breakage often occur. Moreover, quartz is sensitive to impurities, demanding an exceptionally clean machining environment.

To address these challenges, DN Solutions developed a high-performance grinding spindle for the DNC series, capable of 10,000 rpm and 7.5 kW output. This spindle delivers both high productivity and precision, even when machining difficult materials such as quartz and ceramics.

Vibration- and heat-induced errors have also been minimised. The monolithic, high-rigidity bed and high-precision feed-axis guides suppress vibration and prevent thermal displacement during long continuous operations. While conventional machines tend to lose precision due to spindle drift, DN Solutions says its DNC Series ensures long-term accuracy and structural rigidity, extending equipment lifespan.

Fine quartz dust (sludge) produced during machining can cause serious equipment failure. To prevent this, DN Solutions adopted a fully enclosed sliding cover that shields the inclined bed surface, blocking coolant and dust from entering the machine interior.

More information www.dn-solutions.com