Precise hole depth is a critical quality feature in turned metal components made from materials such as copper. Conventional testing methods often reach their limits, particularly with deep or very fine bores, as material properties, surface properties and limited accessibility can make measurements challenging. With the optoCONTROL CLS1000 series of controllers, combined with the CFS4-A11 light guide reflex sensor from Micro-Epsilon, machine shops can detect hole depths on a non-contact basis, reliably and with high precision. 

To detect depth, the CFS4-A11 reflex sensor measures into the bore from above. The deeper the hole, the less reflected light the sensor receives, and the weaker the electrical signal. This allows the detection of extremely small differences in depth, down to 50 μm. Measured values are output directly via the optoCONTROL CLS1000 display, enabling rapid identification of deviations. 

Thanks to its small beam angle of 22°, the CFS4-A11 is particularly suited to measuring deep bores up to 132 mm. The non-contact measurement is independent of material and surface, enabling stable testing even with demanding materials such as copper. As sensors are adapted to customer-specific applications, the solution integrates smoothly into existing manufacturing and testing processes, ensuring consistently high product quality and reducing testing effort in series production. 

The optoCONTROL CLS1000 system comprises a controller and sensor (sensor head and glass fibre-optic cable), with a wide variety of fibre-optic sensor heads and cables available for demanding environments, including high temperatures, aggressive chemicals and vacuums. With a sensing range of up to 2000 mm and ambient light resistance of up to 50,000 lux, the compact, robust controller suits confined installation spaces on machines, robots and production lines, and offers straightforward configuration via its OLED display. 

More information www.micro-epsilon.com 

Hexagon Manufacturing Intelligence has launched its next-generation OPTIV S optical CMM, combining improved speed and accuracy with new AI-assisted measurement capabilities. 

Designed for manufacturers inspecting complex, high-value components, OPTIV S combines advanced vision measurement with tactile and multi-sensor capabilities to increase throughput while simplifying inspection workflows. 

“Manufacturers are under increasing pressure to inspect more parts in less time without compromising accuracy,” says Manuel Mueller, director of product marketing (hardware and software) at the Stationary Metrology Division of Hexagon Manufacturing Intelligence. “OPTIV S was developed to help quality teams meet those demands by combining higher-speed measurement, improved precision and intelligent software capabilities that reduce programming effort.” 

The redesigned platform delivers tactile accuracy of E0, MPEE = (1.6 + L/200) μm and approximately 30% higher machine dynamics through increased travel speeds and acceleration. Initial application tests have also shown inspection cycle times can be reduced by around 15%, while a larger field-of-view vision sensor enables more features to be measured in fewer images. 

New AI-assisted capabilities set for introduction through 2027 include: AI edge detection, which uses camera-light calibration to improve edge detection and measurement consistency; up to 50% faster autofocus; and AI illumination, which automatically optimises lighting parameters. 

The new features are integrated into PC-DMIS and are also being made available for Hexagon’s existing OPTIV M platform, allowing current users to benefit from enhanced programming and inspection consistency. 

OPTIV S, initially available in size 4.4.3, is commercially available now, with additional sizes, configurations and AI-powered capabilities following through 2027. The launch forms part of Hexagon’s wider strategy to apply AI and automation to high-precision inspection, reducing reliance on specialist operator expertise. 

More information www.tinyurl.com/56vw9h7e